Question

求高手帮我翻译一下我的实习经历

2006.8-2006.9在华润上华北京分公司工艺腐蚀部实习，对芯片前期工艺步骤有详细的了解，能够熟练使用干、湿法设备。能熟练应用膜厚仪，阶梯仪。
2006年以学生代表的身份参加了第四界中国半导体封装测试技术与市场研讨会。
2006到乐山-菲尼克斯进行参观学习，对芯片的封装流程有了一定的了解。
2005年7月参加学校全国大学生电子设计大赛的培训
2004-2005年间多次参加校内、系内活动，还担任过百人讲座。
2005和同学一起做网站（ www .fafe .cn），反应比较好

Answer 1

2006.8-2006.9 smooth in the 华 up north China the cent company in the city craft decays a practice, expecting to the chip before the craft step contain detailed understanding, can use the stem, wet method equipments masterly.Thick instrument of well-trained applied film of ability, stairs instrument.
Attended with the body that student represent in 2006 the Chinese semi-conductor of the fourth boundary sealed to pack the test technique and market seminars.
2006 arrive the happy mountain- 菲 尼 gram 斯 to carry on the visit study, seal to pack to the chip the process contain certain understanding.
Attend the training that national university student's electronics in school designs the big match in July 2005
During 2004-2005 years attend the activity inside the school, department for many times, still served as 100 people academic chairs.
2005 do the website with classmate together( www.fafe .Cn), respond better