Question

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复合材料是应现代科学技术发展涌现出的具有极大生命力的材料，它由两种或两种以上的性质不同的材料，通过各种工艺手段组合而成。复合材料的各个组成单元在性能上起协同作用，得到单一材料无法比拟的优越的结合性能，因此，复合材料已成为当代一种新型的工程材料。现代金属基复合材料是从20世纪60年代初发展起来的。60年代初分别以美苏为首的两大阵营宇宙空间开展的竞争带动了航天航空技术的发展，促进了定向凝固复合材料、难容金属丝增强高温合金材料的研究与开发。由于硼纤维的研制成功，并应用于环氧树脂基复合材料，因此出现了硼纤维增强铝基复合材料，并得到了成功的应用。
金属层压板可以通过很多种生产方式加工而成，如爆炸复合法、固-液相结合法以及固相间结合法等。其中冷轧复合优点多，是一种非常有发展潜力的金属层状复合材料制备加工技术。冷轧复合板轧制后要进行一定的热处理以加强界面的结合强度，但同时也带来一定的问题如在界面形成不利于界面结合的化合物等，因此需要对热处理过程中界面化合物的形成规律进行深入的探讨，以便进一步优化工艺制备出界面结合良好且易于加工的复合材料。
铜/铝复合板是典型的金属层状复合材料，具有很多优良的特性，如高比强度、高比模量等，有着广泛的应用前景。本文选择铝/铜层状复合材料作为研究对象，首先利用金相（OM）、X-射线衍射仪（XRD）、扫描电镜（SEM）等实验手段研究了经热处理后冷轧Al/Cu复合界面金属间化合物形成规律，其次采用快速循环加热的热处理工艺，研究Al/Cu复合板的界面结合情况以及材料的相关力学特性。
实验研究结果表明，经过一定温度和时间的热处理后，在铝/铜复合界面上有金属间化合物产生，金属间化合物的产生具有一定的孕育时间。界面金属间化合物层厚度随时间的增加而增加，界面相种类也相应增多。在500℃，保温10分钟后即会产生金属间化合物相，而当500℃保温32小时后，金属间化合物层厚度已经达到了92μm。热处理温度也是界面金属间化合物产生与长大的主要影响因素，随着温度增加，界面化合物层亦增加。在退火扩散过程中，首先产生的金属间化合物相是Al2Cu，然后是AlCu。随着热处理时间加长，先后出现其它相。金属间化合物相具有一定的脆性，不利于界面结合。
实验还发现，金属间化合物在退火过程中的生长受体扩散的控制，厚度随时间的变化关系符合一种抛物线规律，由此我们初步建立了金属间化合物生长的动力学模型。

Answer 1

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Compound material is appear in response to the modern science technique shape surging of have biggest the material of vitality, it from 2 kinds or more than two materials with variant property, combine through various industrial art resort.Reunite the severalty constitutive enzyme unit of material to rise synergy on the properties, receiving single material can not analogy of superior of association properties, therefore, reunite material to have become contemporary kind of constructional material of new model.Modern metalloporphyrin radical composite material the initial issue stretch from the 60's in 20th century.At the beginning of in 60's distinguish the space evolve two greatest camps with arch u.s. - soviet of the rivalry aroused aerospace navigation technical shape, facilitate orientation set composite material, difficult permit the gauze enhancement heat alloy of the research and tapping of material.Because the triturate of boron fiber wins, and Be applied to the epoxy resin radical composite material, therefore appeared boron fiber enhancement the aluminium base reunite material, and received a successful appliance.
Metalloporphyrin laminated wood can process through a lot of mode of productions but become, such as blast composite logarithm of timw fitting method logt, solid-the liquid combine together logarithm of timw fitting method logt and solid phase association logarithm of timw fitting method logt etc..Among them cold rolled composite merit polypeptide, is metalloporphyrin that has much of a shape potential lay-like in shape composite material to make processing technology.The cold rolled compound board stranding system wants to steer definite heat treatment behind to reenforce interface of association strength, but also bring a definite subject at the same time if forming a prejudice in the interface the etc. is at the compound of the interface association, therefore need the study that goes deep into in the middle of the course vs the heat treatment formulating law undertake of interface compound, for the purpose of further excellent chemical engineering skill make foul surface to combine good and be easy to the compound material of transform.
Copper|aluminium composite the board is a lay-like in shape classical metalloporphyrin composite material, have a good many good characteristic, like Gao Bi's strength, and amount of Gao Bi Mo...etc., have extensive appliance fore ground.The text selects aluminium|copper the lay-like in shape composite material is a research object, make use of gold phase(OM) and X-ray first the Yan shot instrument(XRD), scanning electric mirror(SEM) etc. experiment resort to study after heat treatment cold rolled Al|Cu composite interface intermediate compound formulating law, heat treatment industrial art secondly adopt to quickly and circularly heat, study Al|Cu composite knothole interface association the related mechanics characteristic of condition and material.
Test a research result manifestation, after certain gradient of temeprature and the heat treatment in time area concentration diagram, in the aluminium|copper composite there is intermediate compound creation on the interface, the creation of intermediate compound has definite conceive time area concentration diagram.Interface intermediate compound lay thickness with the raise and raise in time area concentration diagram, interface phase the category also correspond to increase.In 500 ℃ , the heat preservation will generate intermediate compound phase after 10 minutes, but when 500 ℃ heat preservations 32 hour after, the intermediate compound lay thickness has already come to a 92 μ ms.The heat treatment gradient of temeprature is also interface intermediate compound creation with cardinal impact factor for growing up, along with the gradient of temeprature raise, the interface compound lay as well raises.In the process of annealing to spread amid, the imprimis generates of the intermediate compound mutually is an Al2 Cus, then is AlCu.Lengthen along with heat treatment time area concentration diagram, successively appear an other mutually.The intermediate compound mutually has definite brittleness, the prejudice combines at the interface.
The experiment also detects that the intermediate compound is in the process of annealing amid of the growth receptorceiving spreads of control, the thickness relates to conform a kind of parabolic curve law with the variance in time area concentration diagram, thereof our initial created the kinetics form of intermediate compound growth.

Answer 2

Composite material is to be the emergence of modern science and technology has great vitality out of the material, which by the nature of two or more different materials, by means of a combination of various processes.The component elements of composite materials from the synergies in performance, get a single material can not match the superior combination of performance, therefore, composite materials have become a new engineering material contemporary. Modern metal matrix composite 60 from the early 20th century to develop.Early 60s were two camps led by the US-Soviet space competition launched driven the development of aerospace technology, and promote the directional solidification of composite materials, difficult to allow high temperature alloy wire enhance the research and development.Since the successful development of boron fibers and epoxy resin-based composite materials used, resulting in a boron fiber reinforced aluminum matrix composite, and has been successfully applied.

Metal laminate can be processed from many types of production methods, such as the explosive compound, solid - liquid and solid phase binding assay combined with law. One more advantage of CR is a very promising metal layered composites processing technology.After cold rolling composite board to conduct some heat treatment to strengthen the interface bonding strength, it also brings some problems such as Jiemianxingcheng Bu favorable bonding of the compounds, it will take on the heat treatment process of the formation of interface compounds Law in-depth study in order to further optimize the bonding process well prepared and easy processing of composite materials.

Copper / aluminum composite panel is a typical metal layered composite material, has many excellent characteristics, such as high specific strength, high specific modulus, etc., have broad application prospects.This selection of aluminum / copper laminated composite materials for the study, the first use of metallography (OM), X-ray diffraction (XRD), scanning electron microscopy (SEM) and other experiments used to study the heat treatment, cold rolled Al / Cu composite interface intermetallic compound formation rules, followed by rapid heating of the heat treatment cycle to study the Al / Cu composite plate bonding as well as materials related to mechanical properties.

Experimental results show that after a certain temperature and time of heat treatment, the aluminum / copper composite interface between the compound and a metal, intermetallic compound formation has a certain incubation time. Interfacial intermetallic compound layer thickness increases with time, type of interface with a corresponding increase.At 500 ℃, after holding for 10 minutes will produce intermetallic phase, and when 500 ℃ for 32 hours, the intermetallic compound layer thickness has been reached 92μm. Heat treatment temperature is generated interface intermetallic compounds and growth of the main factors, as the temperature increases, interfacial compound layer also increased.Diffusion in the annealing process, the first phase intermetallic compound produced is Al2Cu, then AlCu. With longer treatment time, there has other phase. Intermetallic phase has a certain fragility, is not conducive to bonding.

It was also found in the annealing process of intermetallic growth of receptor diffusion in the control of the thickness changes with time relations is a kind of parabolic law, thus we initially established the intermetallic growth kinetics model.