Question

求翻译，急！

有动态绕折或屈曲要求之FPC，在产品厚度许可情况下，选用材料厚度越薄越好。如0.5mil PI+ 1/3 Cu无胶压延铜基材（耐弯折性能：无胶材由于有胶材，压延铜优于电解铜，PI及胶层越薄耐弯性能越好。）
针对CU:1/3OZ基材（包含有胶、无胶）的单、双面板和CU：1/2mil无胶基材只需包封前喷砂，不可磨板。
三层板以上（含三层）的板子不论钻孔孔径大小都需在PTH之前增加一道等离子处理工序。
针对所有FR4补强制作流程，需在钻孔后、冲切前增加双面磨板工序，以求增加FR4与胶膜的结合力。
针对需贴弹片的流程，在组装贴弹片前，增加一个成品检验工序。

麻烦了，要快,谢谢！
还能加分的，谢啦~

Answer 1

A dynamic fold or bend around the demands of the FPC, the thickness of the product without permission, use the thinner the better the material thickness. If 0.5mil PI + 1 / 3 Cu-free plastic rolling copper substrate (resistance to bending performance: non-gel material as a plastic material, the rolling of copper than copper, PI, and resistance to bend the thinner the layer the better the performance.)
For CU: 1/3OZ substrate (including a plastic, non-gel) of single and double panels and CU: 1/2mil non-gel encapsulation matrix just before the blast, can not wear plate.
More than three boards (including three) of the board regardless of the pore size are required to drill before the increase of a plasma PTH treatment processes.
FR4 reinforcement for all production processes, need to drill, the increase of double-sided grinding plate before punching process, in order to increase the FR4 and the film's bonding.
Be posted against the shrapnel of the process, shrapnel in the assembly paste before adding a product testing process.

Answer 2

这种专业术语，不好翻译啊，··