Question

跪求大神英文翻译

Primary Responsibilities:
1.Equipment maintenance on shift to meet planned KPIs goal, work efficiency is10% higher than technician1 with same condition.
2.Execute exactly according Spec, WI, OPL and BKM to maintain equipment.
3.Equipment ramp up and conversion to support production volume loading.
4.Familiar with Underfill,Ball Mount(Asmtek/Protect, SSP) machine maintenance or wafer saw ,Disco Laser and Saw DF7160,DF6361 machine maintenance.
5.Provide technical support / solutions to resolve equipment and hardware related issues.
6.Conduct Training on equipment operation and maintenance to operator and technician1.
7.Meet all company requirements on 5s, quality, EHS and discipline.
8.Perform other duties as required assigned by supervisor.
Must Have:
-Education: high school and above degrees, prefer subject in microelectronics and material
-Language: Basic written skills in English for daily report writing
Experience: 0~2years’ work experience including 0~2 years’ quality expertise experience in a high paced environment

Answer 1

主要职责：

1. 值班时，对硬件的维护需符合预计的KPI，在同样环境下，工作效率需高于技术工10%。

2. 对于硬件的维护完全依照Spec, WI, OPL和BKM。

3. 提升硬件产能和改良(转换)硬件以提高产量。

4. 熟悉Underfill,Ball Mount(Asmtek/Protect, SSP)硬件维护或晶片切割、迪斯科舞厅激光、电锯(？)DF7160,DF6361这两种仪器的维护。

5. 提供技术支持/指导以解决设备和硬件相关问题。

6. 对操作员级技术员提供设备操控与维护的培训。

7. 能满足公司对5s、品质、EHS和纪律的要求。

8. 完成上级另外分配的任务。

必须符合以下条件：

-学历要求：高中及以上，倾向微电子和材料专业。

-语言要求：基础英语写作能力以进行每日汇报。

-经验要求：0~2年工作经验包含0~2年在快节奏环境下有质量的专业经验。