Question

英语高手请进！谢谢啊！

The Cu6Sn5/Cu3Sn layers are formed at most lead-free solder alloy/Cu interfaces, while Cu–Zn compound layers are formed in the Sn–Zn/Cu system. Growth kinetics of intermetallic layers both in solid-state and in soldering are also discussed. Creep and fatigue phenomena are also reviewed. In many aspects of lead-free soldering, much more work is required to establish a sound scientific basis to promote their applications.

答的好一定追加分

Answer 1

而Cu锌复合层数在Sn-Zn/Cu系统，被形成Cu6Sn5/Cu3Sn层数被形成在多数无铅焊剂alloy/Cu接口。 金属间化合的层成长动能学在固体和在焊接也被谈论。 蠕动和疲劳现象也被回顾。 在无铅焊接的许多方面，更多要求工作建立一个酣然的科学依据促进他们的应用。

Answer 2

。。。。。。。。这不是英文的问题的，自己的专业知识，自己查书！！