英语翻译 急求! 谢谢 !
13.8X-RayInspectionX-rayinspectionsystemsarecategorizedintothreetypes:2-DX-ray,3-DX-r...
13.8 X-Ray Inspection
X-ray inspection systems are categorized into three types: 2-D X-ray, 3-D X-ray, and X-ray laminography.
They all use transmission of an X-ray beam through the subject board but differ both in the analysis
techniques, speed, and capabilities.
2-D X-Ray
Basic 2-D transmission X-ray systems are typically used to analyze solder joints on single-sided boards.
Like basic medical X-rays, they transmit a beam through the subject circuit board and analyze the relative
intensities of the transmitted beam. The image generated is a result of attenuation of the beam by all
structures along the path of the beam and results in a gray-scale picture. There is no way to differentiate
among the various structures along the path, since attenuation is the total result of the tin/lead in solder,
trace tinning, copper, and internal metal layers. Therefore, the system must be taught the characteristics
of each board location, and it must be taught from both acceptable board characteristics and unacceptable
board characteristics.
2-D X-ray cannot be used on double-sided boards unless each solder joint is in a unique location
relative to the opposite side of the board. X-ray systems cannot check that the correct component has
been placed or that polarized components are properly oriented. They do a good job of detecting
insufficient solder and voids in joints, since these mean there is less tin/lead in the path of the beam and
therefore less attenuation. They cannot detect a nonwetted joint if the correct volume of solder does exist
in the path of the beam, even if there is a gap between the solder on the lead and the solder on the land.
They also do poorly on the joints with noncollapsible solder balls used with ceramic BGAs. Since the
10/90 Sn/Pb balls used are of a higher density than the 63/37 Sn/Pb eutectic solder used for attachment,
most of the beam is attenuated by the 10/90 balls, and the transmission X-ray systems cannot differentiate
between good and poor eutectic joints.
3楼的拜托 帮帮忙啊!!把所有分数都放上面了!!谢谢! 展开
X-ray inspection systems are categorized into three types: 2-D X-ray, 3-D X-ray, and X-ray laminography.
They all use transmission of an X-ray beam through the subject board but differ both in the analysis
techniques, speed, and capabilities.
2-D X-Ray
Basic 2-D transmission X-ray systems are typically used to analyze solder joints on single-sided boards.
Like basic medical X-rays, they transmit a beam through the subject circuit board and analyze the relative
intensities of the transmitted beam. The image generated is a result of attenuation of the beam by all
structures along the path of the beam and results in a gray-scale picture. There is no way to differentiate
among the various structures along the path, since attenuation is the total result of the tin/lead in solder,
trace tinning, copper, and internal metal layers. Therefore, the system must be taught the characteristics
of each board location, and it must be taught from both acceptable board characteristics and unacceptable
board characteristics.
2-D X-ray cannot be used on double-sided boards unless each solder joint is in a unique location
relative to the opposite side of the board. X-ray systems cannot check that the correct component has
been placed or that polarized components are properly oriented. They do a good job of detecting
insufficient solder and voids in joints, since these mean there is less tin/lead in the path of the beam and
therefore less attenuation. They cannot detect a nonwetted joint if the correct volume of solder does exist
in the path of the beam, even if there is a gap between the solder on the lead and the solder on the land.
They also do poorly on the joints with noncollapsible solder balls used with ceramic BGAs. Since the
10/90 Sn/Pb balls used are of a higher density than the 63/37 Sn/Pb eutectic solder used for attachment,
most of the beam is attenuated by the 10/90 balls, and the transmission X-ray systems cannot differentiate
between good and poor eutectic joints.
3楼的拜托 帮帮忙啊!!把所有分数都放上面了!!谢谢! 展开
展开全部
干什么这么惟利是图!!!我帮你翻译!!!!
bs上面些不帮忙的人。
13.8 x光检查
x光检查系统分为三种类型:二维x光,三维x光, x线分层成像。
它们都使用传输的x光光束通过受董事会,但都不同,在分析
技术,速度和能力。
的2 -d x光
基本2维传输x光系统通常用于分析焊点对单面版。
如基本医疗x光检查,他们传送光束通过主题电路板和分析相对
强度的光束传送。形象产生,是由于衰减光束所有
结构沿着光束和成果在灰度级图像。有没有办法分辨
在众多结构沿着路径,因为是衰减的总成果锡/铅焊料,
微量镀锡,铜及内部金属层。因此,系统必须教导特色
各局的位置,并且要教导双方可接受的董事会特性和不可接受
董事会特性。
的2 -d x射线不能用于双面议会除非每个焊点,是一个独特的位置
相对到对岸的董事会。 x光系统不能检查到,正确成分
现已存放或偏振元件得到妥善导向。他们努力做好检测
不足焊料和孔洞在关节中,因为这些意味着较少,因此锡/铅在道路上梁
为准,所以衰减。他们无法侦测到nonwetted联合,如果正确货量焊料确实存在
在道路上的光束,即使有一些差距焊料对铅和锡在土地上。
他们还做不好就接头noncollapsible焊锡球用陶瓷bgas 。自从
90分之10锡/铅球所用的高密度比37分之63锡/铅共晶焊料用于实习,
大部分的光束衰减由90分之10高尔夫球和传输x光系统,不具备辨别
善和穷人的共晶接头。
bs上面些不帮忙的人。
13.8 x光检查
x光检查系统分为三种类型:二维x光,三维x光, x线分层成像。
它们都使用传输的x光光束通过受董事会,但都不同,在分析
技术,速度和能力。
的2 -d x光
基本2维传输x光系统通常用于分析焊点对单面版。
如基本医疗x光检查,他们传送光束通过主题电路板和分析相对
强度的光束传送。形象产生,是由于衰减光束所有
结构沿着光束和成果在灰度级图像。有没有办法分辨
在众多结构沿着路径,因为是衰减的总成果锡/铅焊料,
微量镀锡,铜及内部金属层。因此,系统必须教导特色
各局的位置,并且要教导双方可接受的董事会特性和不可接受
董事会特性。
的2 -d x射线不能用于双面议会除非每个焊点,是一个独特的位置
相对到对岸的董事会。 x光系统不能检查到,正确成分
现已存放或偏振元件得到妥善导向。他们努力做好检测
不足焊料和孔洞在关节中,因为这些意味着较少,因此锡/铅在道路上梁
为准,所以衰减。他们无法侦测到nonwetted联合,如果正确货量焊料确实存在
在道路上的光束,即使有一些差距焊料对铅和锡在土地上。
他们还做不好就接头noncollapsible焊锡球用陶瓷bgas 。自从
90分之10锡/铅球所用的高密度比37分之63锡/铅共晶焊料用于实习,
大部分的光束衰减由90分之10高尔夫球和传输x光系统,不具备辨别
善和穷人的共晶接头。
展开全部
太少,要尊重他人劳动
13.8
X 射线探伤
X 射线探伤分为三类,2D, 3D 和分层摄像法
它们都使用X 光柱穿过被测面,不同之处在于后来的分析方法,技巧,速度和性能。
2D X光探伤
............
13.8
X 射线探伤
X 射线探伤分为三类,2D, 3D 和分层摄像法
它们都使用X 光柱穿过被测面,不同之处在于后来的分析方法,技巧,速度和性能。
2D X光探伤
............
已赞过
已踩过<
评论
收起
你对这个回答的评价是?
展开全部
本来想翻的,被上面的说了下,算了!
已赞过
已踩过<
评论
收起
你对这个回答的评价是?
展开全部
太专业的,要收人民币的,40分虚拟的东西体现不出劳动的价值呵.
已赞过
已踩过<
评论
收起
你对这个回答的评价是?
展开全部
20少了点
已赞过
已踩过<
评论
收起
你对这个回答的评价是?
推荐律师服务:
若未解决您的问题,请您详细描述您的问题,通过百度律临进行免费专业咨询