Question

请来高手帮忙确认把下面这端话翻译成英语的，这个是要给老板的所以请不要直接用翻译软件！谢谢了！

现在我们已经得到了两种不同包装的调查结果：
散装的wafer在仓库检查后发现18pcs划伤不良，我第一时间将这个不良品拿给我们QC跟MPC的检查员进行了确认，他们告诉我他们能够看到这个划伤但是这个在送回仓库之前是没有的。
袋子分开装的wafer在仓库检查后发现了2pcs非常轻微的划伤。
根据我们上次会议讨论的，可以确定这个划伤是发生在从仓库投入到测试这个期间。另外，我们还可以知道这个散装的包装类型是导致产品划伤的主要原因。我们建议以后取消这种包装类型，全部统一用袋装。

Answer 1

现在我们已经得到了两种不同包装的调查结果：
We have had result for the investigation of two distinct packaging methods.
散装的wafer在仓库检查后发现18pcs划伤不良，我第一时间将这个不良品拿给我们QC跟MPC的检查员进行了确认，他们告诉我他们能够看到这个划伤但是这个在送回仓库之前是没有的。
For wafers in bulk, scratches were found on 18 pieces during warehouse inspection. I confimed the cause of defective products immediately with our QC team and inspectors from MPC. They acknowledged the scratches and stated that no scratches were found prior to sending the wafers to warehouse.

Answer 2

Now we've got two different packing the results of a survey:
bulk of wafer in the warehouse found 18 PCS scratch bad after checking it, I will be confirmthe defective product to our QC and the MPC inspector at the first time, they told me they can see the scratch but this is not before back to the warehouse. Bag packed separately wafer found 2 PCS in warehouse after inspection very minor scratches. According to our discussion of last meeting, can determine the scratches occurred during from the warehouse to test . In addition, we also know that the bulk packing type is a major cause of lead to product scratches. we recommend that this kind of packing type will be canceled, all unified with bags.

Answer 3

Now we have got the survey results of two different packing:
After checking the wafers packing in bulk, there are 18 pieces with deep cut marks. I took those cutted wafer to QC and MPC inspectors immediately, they told me they can identify the cut marks clearly, but it is not there when the wafers shipping into the warehouse.
After checking the wafers packing in bags, there are only 2 pieces with sight cut marks.
According to the discussion from last meeting, it is sure that those cut marks happened during warehouse pilot run. And it is sure that packing in bulk is the mean reason for having cut marks. We suggest, from now on, packing in bulk should be cancelled, using bags to pack all wafers.

Answer 4

Now we have got the searching results of the 2 different packages.

18pcs loose-packed wafer has been found scratch after the check in the warehouse. Then I double checked with our MPC inspectors in QC. and I was told that the sratch didn't exist before the delivery to the warehouse.

20 pcs wafer in bags was found scratched during the check in warehouse.

According to our discussion, we can guarantee that the scratch is happend the period from warehouse to the testing. Besides, we find that the loose package is the main reason that result in the scratch. So we suggest you cancel this type package, and use unified bag package.