Question

急急急，机械专业英语翻译，万分感谢

In Figure 6 is given the SEM image taken after the experiment carried out with
CBN cutting insert at cutting conditions of Vc: 300 m/min., f: 0.15 mm/rev., and
ap: 0.4 mm. Flank wear, crater wear, newly developing notch wear, molten chip,
and adhered chip on to the crater surface are observed. When the flank wear areas
are studied, chips smeared under the effects of friction and pressure can be seen as
well as abrasion wear marks formed in the cutting direction cutting. Crater wear is
observed at high cutting speeds. The reason for this may be the fact that the
carbides in the hardened work piece separate the bonds of the CBN binder and
abrade the tool [2]. The main reason for crater wear is the sliding of the chip on
the chip surface of the tool. The sliding movement abrades the rises and decreases
the waviness of the surface [5]. At the small cutting area, the crater wear occurred
at the chamfer zone of the cutting tool. The shape of the crater wear on the tool is
related to the distribution of the pressure along the chip surface [9]. The crater
wear occurring consequently can change the geometry of the cutting area suddenly
[5, 9]. While the fact that the cutting process is carried out on hardened pieces
and at high cutting speed values is useful with regards to economy or quality, it
also causes the formation of high temperatures at the cutting region. The
increasing temperature increases the diffusion effect that facilitates crater
formation. Furthermore, high cutting speeds give rise to serious tribological
condition at the tool-chip interface, causes the tool coating to peel and the tool to
act consequently as an uncoated tool [9]. When the figure is studied, the presence
of chip can be seen that occurs at the region the contact of the chip with the tools
ends and contact with air starts with a trend to develop. As a result, it can be said
that effects of abrasive and intensely adhesive and diffusive wear mechanism are
seen in the CBN cutter.

Answer 1

在图6中给出了扫描电镜图像进行的实验后
立方氮化硼切削插入的切削条件下风险投资:300米/分钟。f:0.15毫米/转速。,
记者:0.4毫米,侧面磨损,火山口穿,新开发的切口,熔化的芯片,
和坚持芯片到陨石坑表面上观察到。当侧面磨损区域
进行了研究,芯片上摩擦的影响和压力下可以看作是吗
以及磨损痕迹形成的切削方向切割。火山口磨损
观察在高切削速度。原因可能是这一事实
碳化物在淬火工件分离的立方氮化硼粘结剂和债券
研磨工具[2]。火山口磨损的主要原因是芯片的滑动
芯片表面的工具。滑动运动磨损上升和下降
表面波度的[5]。小切削区域,火山口发生磨损
带倒角的刀具。陨石坑的形状工具磨损
有关压力的分布在芯片表面[9]。火山口
磨损发生因此能突然改变切削区域的几何形状
(5、9)。而事实切削过程进行硬块
和在高切削速度值是有用的对于经济或质量
也会造成高温切削区域的形成。的
增加温度上升扩散效应,促进了火山口
形成。此外,高切削速度会导致严重的摩擦磨损
涂层对刀—屑条件的接口,使涂层皮和工具的工具
因此作为一个裸露的工具[9]。研究了图的时候,存在
芯片可以看出,发生在该地区的接触芯片的工具
结束,与空气接触始于一个趋势发展。因此,可以说
,磨料和强烈的胶粘剂,扩散磨损机制的影响
立方氮化硼刀具。